The Universal-TGS200 is a chemical mechanical polishing system specifically engineered for third-generation semiconductor materials (SiC). It is equipped with three polishing modules based on a single-platen double-head design, and integrates post-cleaning modules, enabling double-sided wafer polishing. It features a high level of automation and high processing efficiency. It is suitable for the fabrication of silicon carbide (SiC) substrates, the verification of the performance of polishing consumables, the development of advanced CMP process, and other fields of third-generation semiconductor materials.
3 polishing platens and 6 polishing heads, high polishing pressure, significantly improving the polishing efficiency of high hardness products such as SiC.
Multi zone pressure control for the polishing head, strong surface shape control ability.
Immersion and brush cleaning, achieving high cleanliness requirements.
Automatic flipping for both carbon & silicon side polishing, dry in and dry out, suitable for automated production lines.