Versatile-GM300 is an ultra-precision wafer grinding device innovatively developed for the packaging field. The equipment adopts a new layout, which can realize ultra-precision grinding and stress removal on the back of thin wafer; It is compatible with 8/12-inch wafers, and is equipped with a wafer laminating machine for online use, which can realize the whole process of automatic operation from precise thinning, cleaning and drying to sticking the material ring and back film stripping; The highly reliable wafer handling system effectively reduces the risk of thin wafer damage. Relying on the excellent online thickness measurement and surface defect control technology, the equipment has the advantages of high precision, high rigidity, flexible process development, etc., and meets the needs of thin wafer processing in the packaging field.
TTV<1.5um
Advanced thickness unifommity and surface defect contral technology
Realize fully automatic processing by integrating the grinder with a mounter