Versatile-GP300 is an advanced 12-inch ultra-precision wafer grinding equipment developed according to the current high-end market demand of 3D IC manufacturing, advanced packaging and so on. The equipment integrates advanced ultra-precision grinding, CMP and post-cleaning technology through the innovative layout of the new complete machine, and is equipped with excellent thickness deviation and surface defect control technology. It can provide a variety of system function expansion options, with the advantages of high precision, high rigidity, and flexible process development. Versatile-GP300 can flexibly expand and develop a variety of configurations, which greatly meets the needs of ultra-precision wafer thinning technology in 3D IC manufacturing, advanced packaging and other fields.
Focused on grinding of two stacked silicon wafers in 3D lC
Advanced thickness uniformity and surace defect control technology,TTV<0.8um
Integrating ultra precision grinding and CMP processes
Innawative multi-zone pressure intellipent control svstem to achieve stable and controllable grinding pracess